[Arm-netbook] severe systemd bugs (two of them)

[Luke Kenneth Casson Leighton]

On Wed, Jul 5, 2017 at 6:49 PM, Philip Hands <phil at hands.com> wrote:

> The program that ran most of OpenMoko was written on the assumption that
> it would be very soon replaced by separate components that would all
> pass messages around via d-bus

 ah!  12+ years i'm glad someone remembers.  i got the trolltech
greenphone, not an openmoko

> The result being that if one got an incoming call, it would provoke a
> cascade of (IIRC 7) d-bus interactions that were all being answered by
> call-backs in the single program that was doing everything.  Each one
> went via a kernel context switch (or two?), dumping the cache, and that
> meant that it would take at least 5 seconds for the ringer to start
> ringing after a call came in, a few more seconds to show you the screen
> with the answer button,

 ... which was painted with x11 so that meant many more more
context-switches and cache-dumps because x11 is a client-server
architecture...

> a second or two for your mad tapping to be
> noticed, during which the accelerometer would realise that it needed to
> swap portrait for landscape (repainting the "cancel" button where the
> "answer" used to be) and then finally it would process your demented
> attempts to answer the sodding thing as a call rejection.  Marvelous.

 ... didn't you have call-forwarding such that there wasn't enough
time to actually answer the call anyway? :)

> Enrico Zini worked all that out, and then knocked up a very short script
> that waited for calls, made the ringer ring, and looked out for a button
> press on the physical button -- that allowed it to behave quite like a
> phone with no fuss.

dang.  *sigh* nokia's low-cost mobile phone OS (symbian?) at least was
well-designed (or, designed for purpose).

> If anyone wants an OpenMoko, I have one going cheap  :-/

 ah that would be good to use for the GTA04 motherboard replacement oh
wait damnit that didn't go so well, they used a package-on-package TI
SoC and DDR sandwich, where the processor was only designed for very
specialist mass-volume manufacturing, was made too thin (to save cost)
and warps under standard PCB assembly (ovens)... they got something
like a SEVENTY SEVEN PERCENT failure rate during a pre-production
manufacturing run.

http://laforge.gnumonks.org/blog/20170306-gta04-omap3_pop_soldering/

l.