[Arm-netbook] Thermal considerations

[luke.leighton]

On Sat, Dec 15, 2012 at 12:04 PM, Barry Kauler <bkauler at gmail.com> wrote:
> Excuse me if this has already been discussed, I could not find it in a
> search of this list. But, I guess that it would have been carefully
> considered.
>
> Pictures show the eoma-68 case being metal, and type-II having 3.5
> watts dissipation.
>
> I would think that it would be inadequate to just have air inside the
> casing, so is the plan to fill it with thermal gel?

 yes.

> presuming it is
> do-able in a mass production situation.
>
> Or maybe, at least a flexible thermal pad between SoC and case.
>
> Regards,
> Barry
>
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