[Arm-netbook] Thermal considerations

[Barry Kauler]

Excuse me if this has already been discussed, I could not find it in a
search of this list. But, I guess that it would have been carefully
considered.

Pictures show the eoma-68 case being metal, and type-II having 3.5
watts dissipation.

I would think that it would be inadequate to just have air inside the
casing, so is the plan to fill it with thermal gel? presuming it is
do-able in a mass production situation.

Or maybe, at least a flexible thermal pad between SoC and case.

Regards,
Barry