[Arm-netbook] EOMA68-A20 2.7.4 pre-production prototypes received and working

[Bluey]

> On 16 Jun 2017, at 12:02 AM, Luke Kenneth Casson Leighton <lkcl at lkcl.net> wrote:
> 
> ...
> 
> if anyone knows any tricks i would appreciate hearing them.  i was
> thinking of creating the pad with a triangular end, placing the VIA
> right at the end so that the solder paste can't "wick away".  anyone
> got any other ideas?
> 
> l.
> 

Is it an issue of gravity?  Perhaps it might be possible to apply the solder paste to the board in an upside down orientation (or even just at a high angle)?