[Arm-netbook] HDMI High-Frequency Layout: Recommendations--Taper

[Luke Kenneth Casson Leighton]

On Mon, Dec 18, 2017 at 7:02 AM, Richard Wilbur
<richard.wilbur at gmail.com> wrote:
> On Sun, Dec 17, 2017 at 11:34 PM, Luke Kenneth Casson Leighton
> <lkcl at lkcl.net> wrote:
>> On Mon, Dec 18, 2017 at 6:31 AM, Richard Wilbur
>> <richard.wilbur at gmail.com> wrote:
>>> 1.  Ground keepout under whole ESD component(s) on adjacent reference
>>> ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6),
>>> ground fill on deeper layer (layer 3 for ESD on layer 1, layer 4 for
>>> ESD on layer 6).  Ground fills connected as always using vias (some
>>> probably already adjacent).

>>
>>  clear... except which one to actually deploy :)
>
> Well, I read about #2 in the TI High-Speed Layout but I like #1 better
> because we have high-frequency signals in parallel on both sides of
> the board and I'd feel better because I expect less cross-talk with
> #1.  #1 is a hybrid where we double the distance to the reference
> ground plane but still have ground shield between high-frequency
> signals that would otherwise want to radiate/couple.

 yehyeh, makes sense to me.  okay!  it's also much more straightforward.

l.