[Arm-netbook] HDMI High-Frequency Layout: Recommendations--Taper

[Luke Kenneth Casson Leighton]

On Mon, Dec 18, 2017 at 6:31 AM, Richard Wilbur
<richard.wilbur at gmail.com> wrote:

> Sorry for the misunderstanding.  I wasn't very clear about delineating
> the difference between two options for dealing with the ESD component
> pads.

 i was wondering which one to deploy.

> 1.  Ground keepout under whole ESD component(s) on adjacent reference
> ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6),
> ground fill on deeper layer (layer 3 for ESD on layer 1, layer 4 for
> ESD on layer 6).  Ground fills connected as always using vias (some
> probably already adjacent).
> 2.  Ground keepouts under just high-frequency signal pads of ESD
> components on adjacent reference ground plane (layer 2 for ESD on
> layer 1, layer 5 for ESD on layer 6).
>
> Clear as mud?

 clear... except which one to actually deploy :)

l.