[Arm-netbook] HDMI High-Frequency Layout: Recommendations

Richard Wilbur richard.wilbur at gmail.com
Sat Aug 19 15:07:11 BST 2017


On Aug 18, 2017, at 19:54, Luke Kenneth Casson Leighton <lkcl at lkcl.net> wrote:
> 
> On Thu, Aug 17, 2017 at 5:20 PM, Richard Wilbur
> <richard.wilbur at gmail.com> wrote:
[…]
> So you have a flood-fill on the bottom layer?
> 
> all layers.
> 
>> Is the flood-fill connected to GND?
> 
> only when it's properly arranged to be so... i.e. when you don't you
> get a warning... short answer: yes.
> 
>> Can you set the 15mil copper-to-trace separation as a property of the differential traces?
> 
> yyup.  i really like PADS for this reason
> 
>> The goal with this 15mil clearance is to space other copper
>> in the same plane far enough away to have a negligible effect
>> on the differential impedance of the differential pair and by the
>> same token negligible high-frequency signal coupling.
> 
> okaaay.  i get it.
> 
>> The microstrip differential pair geometry is based on having ground
>> plane (may it extend forever ;>)
> 
> :)
> 
>> underneath the traces separated by a dielectric of thickness t.
>> (We took that into account in the impedance calculations.
> 
> yehyeh.
> 
>> Actually power and ground are identical from the perspective of
>> high-frequency signals so we could have built our microstrip
>> differential pair over a power plane--or even moved from one
>> reference plane to another.
> 
> ohhh that explains why DDR3 has a big power-plane @ the 1/2 way
> "reference" voltage.  nice.
> 
>>> there's one place where the diffpairs go past the main power line
>>> (IPSOUT) - that's got a 5 mil copper GND separating it at present: i'd
>>> be nervous about taking that out.
>> 
>> I wouldn't worry because that 5mil copper GND has
>> 5mil spacing on each side, thus ensuring 15mil between the closest
>> differential trace and power.  That should be sufficient.
> 
> ... need to check it.
> 
>> On the other hand, if I remember correctly the proximity to IPSOUT
>> happened because we decided to do significant inter-pair skew
>> compensation close to the power circuit.
> 
> ah no: it's always been very close: in this revision i particularly
> wanted the vias left of the rclamp0524p to be reasonably symmetrical
> and clean, with a straight (diff-paired) path to the rclamp0524p
> instead of taking a turn to get to it (as in previous revisions).
> 
> that required a little bit more space, which meant moving IPSOUT's
> vias a little bit further over.  i could _probably_ move them over a
> bit further...
> 
> 
>> The other thing that we can do if we have a little extra space
>> after taking out the intermediary GND shield traces and inter-pair
>> skew compensation wiggles is distribute the intra-pair skew
>> compensation closer to the sources of intra-pair skew--corners.
> 
> aw poop - changing those is quite a task.  there's some bugs due to a
> combination of grid snap and push-and-shove in PADS where removing the
> long straights means i can't add them back in again.  and i need to
> remove them because otherwise i don't know how long the traces are
> from the vias.  what i do is:
> 
> * remove the long sections
> * re-add a *short* diffpair section of only about 1mm
> * those end up being equal length
> * then because the traces aren't complete PADS will tell you exactly
> how long they are
> * therefore i can now measure them both and...
> * therefore i know exactly how much manual "wiggle" to put in the shorter one.
> 
> once the wiggles are done i can re-add the long sections, confident
> that the signals will be matched.
> 
> but it's a pain to do! :)
> 
>> Right now you've done a great job of compensating for intra-pair
>> skew in the first segment:  from CPU lands to first via.
> 
> yehyeh.  they're near-identical.
> 
>> Then there are some very significant wiggles when we first get
>> to the bottom layer
> 
> yes.  intra-pair correction due to wanting to have the 1st layer
> traces all the same length.  it's nearly... 1.5mm  to correct, due to
> not just the offset of the vias but also the turn.  if i tried to
> stagger those first vias the other way (which i tried once) then
> there's not enough room to have those 1st trace segments be equal
> length...
> 
>> and I don't see any other intra-pair skew
>> compensation all the way out to the connector.
> 
> that's because they're all fine... ok i read somewhere that it's ok
> to have some intra-pair skew on short lengths between turns.  sooOo...
> i'm assuming that the critical part is the long straight.  sooOOo i
> arranged for the wiggles to make perfect length-matching just as each
> pair hits the beginning of each long straight.
> 
> now (and i've removed the inter-pair skew in the current revision)
> what i *haven't* done is add in any inter-skew correction at the
> points marked in green (attached).  i'm assuming that those diagonal
> cross-paths (between each green ring) are... within acceptable
> tolerance for intra-skew.
> 
>> If we can do it, the most effective place for intra-pair skew compensation
>> is within 15mil of the skew source--right before or after a bend.
>> If skew originates in a bend and is resolved by a complementary bend within 15mils,
>> then we don't need to add anything specific.
> 
> mmmm *grumble, grumble*.... i think there might be space to add them,
> around where the green rings are, by moving the diagonal pieces to the
> right a bit.
> 
>>>> How far are the differential traces from board edge at present?
>>> 
>>> 0.9mm -> 35 mil.
>>> 
>>> to the nearest vias is 0.2mm -> 0.787mil
>> 
>> How far is the board-edge ground shield trace
>> from the edge of the board?
> 
> to the edge of the GND shield trace: 0.46mm -> 18 mil
> 
>> From the closest differential pair trace?
> 
> to the edge of the CK diffpair, 0.93mm -> 36.6 mil
> 
>> How wide is the board-edge ground shield trace?
> 
> pffh :)  peanuts.  very tight.  13 mil (that's to the vias as well,
> which i realise is slightly dodgy).
> 
> 
>> I'm guessing you meant the closest vias to the differential pair
>> traces are 0.2mm = 7.87mil?
> 
> yyep.
> 
>> Are these the ground-to-ground vias for low-impedance connection
>> of reference planes?  (Low-impedance return path close to signal vias?)
> 
> honestly i haven't been thinking in terms so specific: i just add
> them arbitrarily because i heard it was the right thing to do!
> learning fast...
> 
> l.
> <Untitled.jpg>
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