[Arm-netbook] EOMA68-A20 2.7.4 pre-production prototypes received and working
bluey at smallfootprint.info
Thu Jun 15 15:16:00 BST 2017
> On 16 Jun 2017, at 12:02 AM, Luke Kenneth Casson Leighton <lkcl at lkcl.net> wrote:
> if anyone knows any tricks i would appreciate hearing them. i was
> thinking of creating the pad with a triangular end, placing the VIA
> right at the end so that the solder paste can't "wick away". anyone
> got any other ideas?
Is it an issue of gravity? Perhaps it might be possible to apply the solder paste to the board in an upside down orientation (or even just at a high angle)?
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