[Arm-netbook] EOMA68-A20 2.7.4 pre-production prototypes received and working

Bluey bluey at smallfootprint.info
Thu Jun 15 15:16:00 BST 2017

> On 16 Jun 2017, at 12:02 AM, Luke Kenneth Casson Leighton <lkcl at lkcl.net> wrote:
> ...
> if anyone knows any tricks i would appreciate hearing them.  i was
> thinking of creating the pad with a triangular end, placing the VIA
> right at the end so that the solder paste can't "wick away".  anyone
> got any other ideas?
> l.

Is it an issue of gravity?  Perhaps it might be possible to apply the solder paste to the board in an upside down orientation (or even just at a high angle)?

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