Date: Thu, 15 Jun 2017 15:02:07 +0100 From: Luke Kenneth Casson Leighton lkcl@lkcl.net
it was discovered that the VIAs underneath the pads for the JAE DC3 Micro-HDMI connector are sucking the solder paste in and down, leaving the pins not properly connected. ...
if anyone knows any tricks i would appreciate hearing them.
Can you enlarge the solder mask for these pads, thus providing enough solder to both fill the via and make the connection?
This is the standard recommendation when using thermal pads / thermal vias.
On Sun, Jun 18, 2017 at 11:57 PM, Andrew Bolin fivepointpalmexplodingheart@gmail.com wrote:
Can you enlarge the solder mask for these pads, thus providing enough solder to both fill the via and make the connection?
This is the standard recommendation when using thermal pads / thermal vias.
indeed. this was the recommendation of mike, at the factory. there is however veery little room to do that.
buut... *deep breath*... a closer examination of the 10 samples shows that the DC3 connector is more complex than i initially thought. the 4 through-hole ground connectors on the metal case are not just simple through-hole pins: the two back ones have an additional lip which i did not anticipate being there.
looking at the datasheet this "lip" is supposed to be in direct contact with the board (not down a hole or over the edge of the PCB or anything) but that does not explain why the outer set of pins are in contact with the PCB but the inner set are not.
the only thing that i can think of is: either the connector was damaged during (as part of) its installation with a heat-gun, or it was already damaged and the outer pins bent downwards.
i'll have to inspect the samples i have here more closely.
l.
arm-netbook@lists.phcomp.co.uk
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Andrew Bolin -
Luke Kenneth Casson Leighton