15 Jun
2017
15 Jun
'17
2:16 p.m.
On 16 Jun 2017, at 12:02 AM, Luke Kenneth Casson Leighton lkcl@lkcl.net wrote:
...
if anyone knows any tricks i would appreciate hearing them. i was thinking of creating the pad with a triangular end, placing the VIA right at the end so that the solder paste can't "wick away". anyone got any other ideas?
l.
Is it an issue of gravity? Perhaps it might be possible to apply the solder paste to the board in an upside down orientation (or even just at a high angle)?