18 Dec
2017
18 Dec
'17
6:34 a.m.
On Mon, Dec 18, 2017 at 6:31 AM, Richard Wilbur richard.wilbur@gmail.com wrote:
Sorry for the misunderstanding. I wasn't very clear about delineating the difference between two options for dealing with the ESD component pads.
i was wondering which one to deploy.
- Ground keepout under whole ESD component(s) on adjacent reference
ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6), ground fill on deeper layer (layer 3 for ESD on layer 1, layer 4 for ESD on layer 6). Ground fills connected as always using vias (some probably already adjacent). 2. Ground keepouts under just high-frequency signal pads of ESD components on adjacent reference ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6).
Clear as mud?
clear... except which one to actually deploy :)
l.