22 Nov
2017
22 Nov
'17
5:13 a.m.
http://rhombus-tech.net/riscv/shakti/m_class/pinouts/
added the smartphone/tablet scenario, added DDR3, SYS and POWER pins.... total comes to 290! that's around 18x18 on a side, maybe 19x19 to make space for routing, which in a BGA form-factor @ 0.8mm pitch would be a 15x15mm package!
0.8mm deliberately because it's far, far easier to do a PCB with larger vias, and you can (i think) just about get a 4mil maybe even a 5mil trace in between 0.8mm BGA pads.
cooool :)
l.